Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | E+ |
Number of Pins | 29 |
Transistor Element Material | SILICON |
Operating Temperature | -40°C~125°C TJ |
Published | 2007 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 17 |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Subcategory | Insulated Gate BIP Transistors |
Max Power Dissipation | 2.2kW |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | MWI |
Pin Count | 29 |
JESD-30 Code | R-XUFM-X17 |
Qualification Status | Not Qualified |
Number of Elements | 6 |
Configuration | Three Phase |
Case Connection | ISOLATED |
Power - Max | 2200W |
Transistor Application | POWER CONTROL |
Polarity/Channel Type | N-CHANNEL |
Input | Standard |
Collector Emitter Voltage (VCEO) | 2.7V |
Max Collector Current | 500A |
Current - Collector Cutoff (Max) | 1mA |
Collector Emitter Breakdown Voltage | 1.7kV |
Voltage - Collector Emitter Breakdown (Max) | 1700V |
Input Capacitance | 33nF |
Turn On Time | 290 ns |
Vce(on) (Max) @ Vge, Ic | 2.7V @ 15V, 300A |
Turn Off Time-Nom (toff) | 610 ns |
IGBT Type | NPT |
NTC Thermistor | Yes |
Gate-Emitter Voltage-Max | 20V |
Input Capacitance (Cies) @ Vce | 33nF @ 25V |
RoHS Status | ROHS3 Compliant |