Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Chassis Mount |
Package / Case | Module |
Surface Mount | NO |
Number of Pins | 261 |
Weight | 699.893027g |
Diode Element Material | SILICON |
Packaging | Tray |
Published | 2003 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XUFM-X2 |
Operating Temperature (Max) | 150°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 40mA @ 2600V |
Output Current | 210A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -40°C~135°C |
Application | GENERAL PURPOSE |
Halogen Free | Not Halogen Free |
Voltage - DC Reverse (Vr) (Max) | 2600V |
Current - Average Rectified (Io) | 260A |
Number of Phases | 1 |
Max Repetitive Reverse Voltage (Vrrm) | 2.6kV |
Non-rep Pk Forward Current-Max | 8300A |
Reverse Voltage | 2.6kV |
Max Forward Surge Current (Ifsm) | 8.3kA |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |