NLV17SG34AMUTCG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 6-UFDFN |
| Number of Pins | 6 |
| Operating Temperature | -55°C~125°C TA |
| Packaging | Tape & Reel (TR) |
| Published | 2014 |
| Series | MiniGate™ |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Technology | CMOS |
| Voltage - Supply | 0.9V~3.6V |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Number of Functions | 1 |
| Supply Voltage | 1.1V |
| Terminal Pitch | 0.5mm |
| Output Type | Push-Pull |
| Number of Elements | 1 |
| Supply Voltage-Min (Vsup) | 0.9V |
| Family | LVP |
| Logic Function | Buffer, Inverting |
| Current - Output High, Low | 8mA 8mA |
| Logic Type | Buffer, Non-Inverting |
| Propagation Delay (tpd) | 22.4 ns |
| Height Seated (Max) | 0.55mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
NLV17SG34AMUTCG Overview
Logical driver uses a neat 6-UFDFN package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 0.9V~3.6V. Qualified to operate within -55°C~125°C TA. The high and low logic state output current of logical driver is 8mA 8mA. Logical driver can deal with Push-Pull output (s). All of the 1 elements are put into use. Digital buffer is one of the MiniGate? series devices. 6 terminations with different functions. Buffer IC reuqires a supply voltage of 1.1V. Family LVP includes the buffer IC . Buffer IC is suitable for Surface Mount applications. Logical driver has 6 pins. To supply the device, a minimum voltage of 0.9V is a must.
NLV17SG34AMUTCG Features
NLV17SG34AMUTCG Applications
There are a lot of ON Semiconductor NLV17SG34AMUTCG Buffers & Transceivers applications.
- Wireless 3D game
- VoIP phones
- Wireless transmission
- Broadcast application
- Structural bonding
- Precision engineering measurement
- Carrier phase observations
- TV signal transmission
- Wireless showroom
- Laser diode bonding
