Parameters | |
---|---|
Rds On (Max) @ Id, Vgs | 65m Ω @ 3.3A, 4.5V |
Vgs(th) (Max) @ Id | 1.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 465pF @ 16V |
Current - Continuous Drain (Id) @ 25°C | 2.5A Ta |
Gate Charge (Qg) (Max) @ Vgs | 6nC @ 4.5V |
Rise Time | 17ns |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 17 ns |
Turn-Off Delay Time | 17 ns |
Continuous Drain Current (ID) | 4.5A |
Gate to Source Voltage (Vgs) | 8V |
Drain-source On Resistance-Max | 0.065Ohm |
Drain to Source Breakdown Voltage | 20V |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |
Lifecycle Status | LAST SHIPMENTS (Last Updated: 2 days ago) |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SMD, Flat Lead |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2005 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 20V |
Technology | MOSFET (Metal Oxide) |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Current Rating | 3.3A |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 8 |
Qualification Status | Not Qualified |
Number of Elements | 2 |
Power Dissipation-Max | 640mW Ta |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.13W |
FET Type | N-Channel |
Transistor Application | SWITCHING |