Parameters | |
---|---|
Number of Terminations | 5 |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 5 |
Number of Elements | 1 |
Power Dissipation-Max | 890mW Ta 62.5W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 62.5W |
Case Connection | DRAIN |
Turn On Delay Time | 16 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.5m Ω @ 30A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 3100pF @ 12V |
Current - Continuous Drain (Id) @ 25°C | 13A Ta 130A Tc |
Gate Charge (Qg) (Max) @ Vgs | 52nC @ 11.5V |
Rise Time | 31ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 11.5V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 13 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | 20A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 208A |
Avalanche Energy Rating (Eas) | 392 mJ |
Height | 1.1mm |
Length | 5.1mm |
Width | 6.1mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
Contact Plating | Tin |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN, 5 Leads |
Surface Mount | YES |
Number of Pins | 5 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2006 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |