Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN, 5 Leads |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2009 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Powers |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 8 |
JESD-30 Code | R-PDSO-F6 |
Number of Elements | 1 |
Power Dissipation-Max | 870mW Ta 41.7W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 5.7W |
Case Connection | DRAIN |
Turn On Delay Time | 12.1 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 7m Ω @ 30A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2113pF @ 12V |
Current - Continuous Drain (Id) @ 25°C | 8.6A Ta 59A Tc |
Gate Charge (Qg) (Max) @ Vgs | 33nC @ 11.5V |
Rise Time | 20.6ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 2.9 ns |
Turn-Off Delay Time | 21.9 ns |
Continuous Drain Current (ID) | 13.5A |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 59A |
Drain to Source Breakdown Voltage | 30V |
Height | 1.1mm |
Length | 5.1mm |
Width | 6.1mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |