Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 3 days ago) |
Mounting Type | Surface Mount |
Package / Case | 6-TSSOP, SC-88, SOT-363 |
Surface Mount | YES |
Number of Pins | 6 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Subcategory | FET General Purpose Power |
Max Power Dissipation | 270mW |
Pin Count | 6 |
Number of Elements | 2 |
Element Configuration | Dual |
Power Dissipation | 550mW |
Turn On Delay Time | 83 ns |
FET Type | 2 N-Channel (Dual) |
Rds On (Max) @ Id, Vgs | 375m Ω @ 630mA, 4.5V |
Vgs(th) (Max) @ Id | 1.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 46pF @ 20V |
Current - Continuous Drain (Id) @ 25°C | 630mA |
Gate Charge (Qg) (Max) @ Vgs | 3nC @ 4.5V |
Rise Time | 227ns |
Fall Time (Typ) | 506 ns |
Turn-Off Delay Time | 786 ns |
Continuous Drain Current (ID) | 910mA |
Gate to Source Voltage (Vgs) | 12V |
Drain Current-Max (Abs) (ID) | 0.91A |
Drain to Source Breakdown Voltage | 20V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |