Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mounting Type | Surface Mount |
Package / Case | 3-XFDFN |
Number of Pins | 3 |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Technology | MOSFET (Metal Oxide) |
Pin Count | 3 |
Number of Elements | 1 |
Power Dissipation-Max | 360mW Ta 2.7W Tc |
Element Configuration | Single |
Power Dissipation | 715mW |
Turn On Delay Time | 19 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 4.1 Ω @ 200mA, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 46pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 300mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 0.72nC @ 4.5V |
Rise Time | 30ns |
Drain to Source Voltage (Vdss) | 30V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 38 ns |
Turn-Off Delay Time | 65 ns |
Continuous Drain Current (ID) | 300mA |
Gate to Source Voltage (Vgs) | 8V |
Max Dual Supply Voltage | -30V |
Drain to Source Breakdown Voltage | -30V |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |