Parameters |
Package / Case |
423-LFBGA, FCBGA |
Supplier Device Package |
423-FCBGA (16x16) |
Operating Temperature |
0°C~90°C TJ |
Packaging |
Tray |
Series |
OMAP-35xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Speed |
600MHz |
Core Processor |
ARM® Cortex®-A8 |
Voltage - I/O |
1.8V 3.0V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR |
USB |
USB 1.x (3), USB 2.0 (1) |
Additional Interfaces |
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART |
Co-Processors/DSP |
Signal Processing; C64x+, Multimedia; NEON™ SIMD |
Display & Interface Controllers |
LCD |
RoHS Status |
ROHS3 Compliant |
OMAP3525DCUS Overview
The microprocessor is convenient for international shipping since it is packaged in 423-LFBGA, FCBGA. High reliability can be achieved by using the advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. K0°C~90°C TJw what the operating temperature is around 0°C~90°C TJ. This is part of the OMAP-35xx series. The CPU is cored by a processor with a number of 0 cores. There are LPDDR RAM controllers used by this CPU. To serve better this microprocessor features HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART interfaces. In this CPU, I/O is set to 1.8V 3.0V. 423-FCBGA (16x16) package is offered by suppliers.
OMAP3525DCUS Features
ARM? Cortex?-A8 Core
OMAP3525DCUS Applications
There are a lot of Rochester Electronics, LLC OMAP3525DCUS Microprocessor applications.
- PDAs, game consoles
- Traditional industrial transformation
- Fire detection & safety devices
- Fabric
- Dryers
- Laminators
- Magnetic resonance imaging (MRI)
- Toys
- Smartphones-calling, video calling, texting, email
- Office automation equipment and computer peripherals