Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 6 days ago) |
Mount | Surface Mount |
Package / Case | 515-VFBGA, FCBGA |
Number of Pins | 515 |
Operating Temperature | 0°C~90°C TJ |
Packaging | Tray |
Series | OMAP-35xx |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 515 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | Graphics Processors |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 0.4mm |
Frequency | 600MHz |
Base Part Number | OMAP3530 |
Pin Count | 515 |
Voltage | 1.35V |
Interface | I2C, SPI, UART, USB |
Max Supply Voltage | 1.35V |
Min Supply Voltage | 985mV |
Memory Size | 112kB |
RAM Size | 64kB |
Memory Type | L2 Cache, ROM, SRAM |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A8 |
Data Bus Width | 32b |
Core Architecture | ARM |
Voltage - I/O | 1.8V 3.0V |
Number of UART Channels | 3 |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR |
USB | USB 1.x (3), USB 2.0 (1) |
Additional Interfaces | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART |
Co-Processors/DSP | Signal Processing; C64x+, Multimedia; NEON™ SIMD |
Number of Cores | 1 |
Display & Interface Controllers | LCD |
Height | 900μm |
Length | 12mm |
Width | 12mm |
Thickness | 610μm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
OMAP3530ECBB Applications Processor is based on the enhanced OMAP 3 architecture. The Applications Processors architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: Streaming video, Video conferencing, and High-resolution still image. The OMAP3530ECBB supports high-level operating systems (HLOSs), such as Linux?, Windows? CE, and Android?. This OMAP3530ECBB device includes state-of-the-art power-management techniques required for high-performance mobile products.
OMAP? 3 Architecture
MPU Subsystem
-Up to 720-MHz ARM? Cortex?-A8 Core
-NEON? SIMD Coprocessor
High-Performance Image, Video, Audio (IVA2.2?) Accelerator Subsystem
PowerVR? SGX? Graphics Accelerator
Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+ DSP Core
C64x+ L1 and L2 Memory Architecture
ARM Cortex-A8 Core
112KB of ROM
64KB of Shared SRAM
Portable Navigation Devices
Portable Media Player
Digital Video Camera
Portable Data Collection
Point-of-Sale Devices
Gaming
Web Tablet
Smart White Goods
Smart Home Controllers