OMAP5910JGDY2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Package / Case | 289-BGA |
| Number of Pins | 289 |
| Operating Temperature | -40°C~85°C TC |
| Packaging | Tray |
| Series | OMAP-59xx |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 289 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.31.00.01 |
| Subcategory | Digital Signal Processors |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 220 |
| Supply Voltage | 1.6V |
| Terminal Pitch | 1mm |
| Frequency | 150MHz |
| Base Part Number | OMAP5910 |
| Pin Count | 289 |
| Operating Supply Voltage | 1.6V |
| Voltage | 1.675V |
| Interface | I2C, MMC, SDIO, UART, USB |
| Memory Size | 32kB |
| Nominal Supply Current | 170mA |
| RAM Size | 160kB |
| Memory Type | FLASH |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, MIXED |
| Core Processor | ARM9TDMI |
| Bit Size | 16 |
| Data Bus Width | 32b |
| Number of Timers/Counters | 6 |
| Address Bus Width | 25 |
| Core Architecture | ARM |
| On Chip Program ROM Width | 16 |
| Boundary Scan | YES |
| Low Power Mode | YES |
| Format | FIXED POINT |
| Integrated Cache | YES |
| Voltage - I/O | 1.8V 2.75V 3.3V |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | SDRAM |
| USB | USB 2.0 (2) |
| Additional Interfaces | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART |
| Co-Processors/DSP | Signal Processing; C55x, System Control; CP15 |
| ROM Programmability | MROM |
| Barrel Shifter | NO |
| Internal Bus Architecture | MULTIPLE |
| Display & Interface Controllers | Keypad, LCD |
| Number of DMA Channels | 6 |
| Height Seated (Max) | 2.32mm |
| Length | 19mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
OMAP5910JGDY2 Description
The OMAP5910JGDY2 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices. The OMAP? platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution. The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating an OMAP5910JGDY2 DSP core and a high-performance TI925T ARM core. The OMAP5910JGDY2 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS? software kernel foundation, and is available in a 289-ball MicroStar BGA? package.
OMAP5910JGDY2 Features
Low-Power, High-Performance CMOS Technology
TI925T (MPU) ARM9TDMI? Core
192K Bytes of Shared Internal SRAM
Memory Traffic Controller (TC)
9-Channel System DMA Controller
DSP Memory Management Unit
Endianism Conversion Logic
OMAP5910JGDY2 Applications
Applications processing devices
Mobile communications
Video and image processing (MPEG4, JPEG, Windows? Media Video, etc.)
Advanced speech applications (text-to-speech, speech recognition)
Audio processing
Graphics and video acceleration
Generalized web access
Data processing
