Parameters | |
---|---|
Bit Size | 16 |
Data Bus Width | 32b |
Number of Timers/Counters | 6 |
Address Bus Width | 26 |
Core Architecture | ARM |
Boundary Scan | YES |
Low Power Mode | YES |
Format | FIXED POINT |
Integrated Cache | YES |
Voltage - I/O | 1.8V 2.75V 3.3V |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | LPDDR |
USB | USB 1.1 (1), USB 1.x (2) |
Additional Interfaces | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UART |
Co-Processors/DSP | Signal Processing; C55x, System Control; CP15 |
Barrel Shifter | NO |
Internal Bus Architecture | MULTIPLE |
Security Features | Cryptography, Random Number Generator |
Display & Interface Controllers | Keyboard, LCD |
Number of DMA Channels | 6 |
Height Seated (Max) | 2.32mm |
Length | 19mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Package / Case | 289-BGA |
Number of Pins | 289 |
Weight | 1.241794g |
Operating Temperature | -40°C~85°C TC |
Packaging | Tube |
Series | OMAP-59xx |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 289 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Subcategory | Digital Signal Processors |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.6V |
Terminal Pitch | 1mm |
Frequency | 192MHz |
Base Part Number | OMAP5912 |
Pin Count | 289 |
Operating Supply Voltage | 3.3V |
Voltage | 1.65V |
Interface | I2C, MMC, SDIO, UART, USB |
Memory Size | 24kB |
Nominal Supply Current | 326mA |
RAM Size | 250kB |
Memory Type | FLASH |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, MIXED |
Core Processor | ARM926EJ-S |
OMAP5912ZDY is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices. The OMAP platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.
Low-Power, High-Performance CMOS Technology
ARM926EJ-S (MPU) Core
250K Bytes of Shared Internal SRAM
DSP Memory Management Unit
Hardware Accelerators for Cryptographic Functions
Individual Power-Saving Modes for MPU/DSP/TC
Applications Processing Devices
Mobile Communications
Video and Image Processing
Advanced Speech Applications
Audio Processing
Graphics and Video Acceleration