OMAPL138BZCEA3E
| Parameters | |
|---|---|
| Package / Case | 361-LFBGA |
| Supplier Device Package | 361-NFBGA (13x13) |
| Operating Temperature | -40°C~105°C TJ |
| Packaging | Tray |
| Series | OMAP-L1x |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 375MHz |
| Core Processor | ARM926EJ-S |
| Voltage - I/O | 1.8V 3.3V |
| Ethernet | 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | SDRAM |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
| Additional Interfaces | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART |
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 |
| Security Features | Boot Security, Cryptography |
| Display & Interface Controllers | LCD |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |
OMAPL138BZCEA3E Overview
The microprocessor is convenient for international shipping since it is packaged in 361-LFBGA. High reliability can be achieved by using the advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. The operating temperature around -40°C~105°C TJ should be understood. The OMAP-L1x series contains it. This CPU is cored with a ARM926EJ-S processor. There are SDRAM RAM controllers on this CPU. Microprocessors with HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART interfaces are designed to serve users better. 1.8V 3.3V is the CPU's I/O address. Suppliers offer the 361-NFBGA (13x13) package.
OMAPL138BZCEA3E Features
ARM926EJ-S Core
OMAPL138BZCEA3E Applications
There are a lot of Rochester Electronics, LLC OMAPL138BZCEA3E Microprocessor applications.
- Communication-bluetooth, Wi-Fi, radio
- Process control devices
- Aerospace navigation systems
- Toys
- Network communication, mobile communication field
- Dishwashers
- Petrochemical
- Smartphones-calling, video calling, texting, email
- DVD\DV\MP3 players
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
