Parameters |
Factory Lead Time |
1 Week |
Package / Case |
SIP |
Operating Temperature |
0°C~85°C |
Published |
2016 |
Series |
OSD335x |
Size / Dimension |
1.06 x 1.06 27.0mmx27.0mm |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Connector Type |
400-BGA |
Max Operating Temperature |
85°C |
Min Operating Temperature |
0°C |
Speed |
1GHz |
RAM Size |
512MB |
Core Processor |
ARM® Cortex®-A8, AM3358 |
Module/Board Type |
MPU Core |
Co-Processor |
NEON™ SIMD |
RoHS Status |
ROHS3 Compliant |
OSD3358-512M-BAS Overview
A MPU Core-type board or module is used in this microcontroller.Microprocessor chip is powered by a processor with a total of ARM? Cortex?-A8, AM3358 cores in it.The default setting of the microcontroller is 0°C~85°C.400-BGA' stands for connector type.I would say that MCU chip belongs to the OSD335x Series.As a result, the RAM size of the software has been reduced to 512MB in order to ensure that MCU chip runs normally.During operation, the MCU chip moves at 1GHz speed.In addmicroprocessorion to that, microprocessor is packaged wmicroprocessorh SIP.The maximum operational temperature at this time is 85°C.Microprocessor should be warmer than 0°C when microprocessor is operating.An Intel NEON? SIMD Core Processor is at the heart of this MCUs.
OSD3358-512M-BAS Features
Core processor of ARM? Cortex?-A8, AM3358
Speed of 1GHz
OSD3358-512M-BAS Applications
There are a lot of Octavo Systems LLC OSD3358-512M-BAS Microcontroller, Microprocessor, FPGA Modules applications.
- Process Monitoring
- Embedded Instrumentation
- Patient Monitoring
- Industrial Instrumentation
- Home and Building Automation
- Industrial Gateways
- Process Control
- Industrial Automation
- Medical Devices
- Embedded User Interfaces