Parameters | |
---|---|
Factory Lead Time | 1 Week |
Surface Mount | YES |
Operating Temperature | 0°C~85°C |
Series | OSD335x |
Size / Dimension | 1.06 x 1.06 27.0mmx27.0mm |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 400 |
Connector Type | 400-BGA |
Additional Feature | 24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Supply Voltage | 1.1V |
Terminal Pitch | 1.27mm |
JESD-30 Code | S-PBGA-B400 |
Speed | 1GHz |
RAM Size | 512MB |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A8, AM3358 |
Address Bus Width | 16 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 8 |
Format | FIXED POINT |
Integrated Cache | YES |
Module/Board Type | MPU Core |
Flash Size | 4GB |
Co-Processor | NEON™ SIMD |
Height Seated (Max) | 2.6mm |
Length | 27mm |
Width | 27mm |
RoHS Status | ROHS3 Compliant |