Parameters | |
---|---|
Factory Lead Time | 1 Week |
Operating Temperature | -40°C~85°C |
Published | 2016 |
Series | OSD335x |
Size / Dimension | 1.06 x 1.06 27.0mmx27.0mm |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Connector Type | 400-BGA |
Speed | 1GHz |
RAM Size | 512MB |
Core Processor | ARM® Cortex®-A8, AM3358 |
Module/Board Type | MPU Core |
Co-Processor | NEON™ SIMD |
RoHS Status | ROHS3 Compliant |