Parameters | |
---|---|
Published | 2004 |
Series | TwinSLIC™ |
JESD-609 Code | e0 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Terminal Finish | Tin/Lead (Sn/Pb) |
Applications | SLIC |
Technology | Mixed Technology |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 2 |
JESD-30 Code | R-PDSO-C2 |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 85°C |
Operating Temperature (Min) | -40°C |
Temperature Grade | INDUSTRIAL |
Number of Circuits | 1 |
Telecom IC Type | SURGE PROTECTION CIRCUIT |
Voltage - Clamping | 130V |
Length | 4.395mm |
Width | 3.75mm |
RoHS Status | Non-RoHS Compliant |
Mounting Type | Surface Mount |
Package / Case | DO-214AA, SMB |
Surface Mount | YES |
Packaging | Bulk |