Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Package Accepted | SOIC |
Size / Dimension | 1.250Lx0.500W 31.75mmx12.70mm |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Termination | Solder |
ECCN Code | EAR99 |
Number of Positions | 24 |
HTS Code | 8536.69.40.40 |
Pitch | 0.050 1.27mm |
Reach Compliance Code | unknown |
Number of Contacts | 24 |
Lead Length | 3.175mm |
Device Socket Type | IC SOCKET |
Proto Board Type | SMD to DIP |
Board Thickness | 0.031 0.79mm 1/32 |
RoHS Status | RoHS Compliant |