Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Phosphor Bronze |
Mount |
Edge, Through Hole |
Mounting Type |
Board Edge, Straddle Mount |
Housing Material |
Nylon |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~125°C |
Packaging |
Tube |
Published |
2011 |
Series |
PCI Express® (PCIe) |
JESD-609 Code |
e3 |
Feature |
Locking Ramp |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder |
ECCN Code |
EAR99 |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
64 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
HTS Code |
8536.69.40.40 |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
NO |
DIN Conformance |
NO |
IEC Conformance |
NO |
Filter Feature |
NO |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.039 1.00mm |
Total Number of Contacts |
64 |
Orientation |
Straight |
Depth |
11mm |
Current Rating |
2.5A |
Number of Conductors |
ONE |
Contact Finish |
Gold |
Reliability |
COMMERCIAL |
Number Of PCB Rows |
2 |
PCB Contact Pattern |
RECTANGULAR |
Contact Style |
BELLOWED TYPE |
Card Type |
PCI Express™ |
Read Out |
Dual |
Body/Shell Style |
SOCKET |
PCB Contact Row Spacing |
1.4986 mm |
Contact Pattern |
RECTANGULAR |
Mating Contact Row Spacing |
0.04 inch |
Length |
39mm |
Width |
7.3mm |
Contact Finish Thickness |
Flash |
Card Thickness |
0.062 1.57mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
PCIE-064-02-F-D-EMS2 Overview
A package was prepared according to Tube's specifications.You should mount it with type Board Edge, Straddle Mount.The device is connected via the connector socket CARD EDGE CONNECTOR.Locking Ramp features are included in the device.PCI Express? (PCIe) tells you the series of the device.
PCIE-064-02-F-D-EMS2 Features
PCI Express? (PCIe) series
PCIE-064-02-F-D-EMS2 Applications
There are a lot of Samtec Inc. PCIE-064-02-F-D-EMS2 Edgeboard Connectors applications.
- 3-phase power control
- Broadband data applications
- CMOS Image sensors for mobile applications
- High Speed Data Acquisition for PCs
- In-building wireless telephony
- Digital beam-forming systems for ultrasound
- Communication test equipment
- RADAR processing, digital oscilloscopes
- Industrial Process Control
- Automotive