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PCX755CVZFU400LE

PowerPC Microprocessor PCX755 360-BBGA Exposed Pad


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-PCX755CVZFU400LE
  • Package: 360-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 140
  • Description: PowerPC Microprocessor PCX755 360-BBGA Exposed Pad (Kg)

Details

Tags

Parameters
Package / Case 360-BBGA Exposed Pad
Supplier Device Package 360-PBGA (25x25)
Operating Temperature -40°C~110°C TJ
Packaging Tray
Published 2006
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX755
Speed 400MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RoHS Status Non-RoHS Compliant

PCX755CVZFU400LE Overview


Since the microprocessor is packed in 360-BBGA Exposed Pad, shipping overseas is convenient. High reliability is provided by the advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. Understand the operating temperature around -40°C~110°C TJ. PowerPC processors are embedded in this CPU. 2.5V 3.3V is the CPU's I/O address. Use PCX755 when searching for variants of the embedded microprocessor. A supplier offers a 360-PBGA (25x25) package.

PCX755CVZFU400LE Features


PowerPC Core

PCX755CVZFU400LE Applications


There are a lot of Microchip Technology PCX755CVZFU400LE Microprocessor applications.

  • Office automation equipment and computer peripherals
  • Gas monitoring systems
  • Torpedo guidance
  • Network application field
  • DDC control
  • Heater/Fan
  • Dryers
  • Auto-breaking system
  • DCS control intelligent sensor
  • ECG machine

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