Parameters |
Package / Case |
360-BBGA Exposed Pad |
Supplier Device Package |
360-PBGA (25x25) |
Operating Temperature |
-40°C~110°C TJ |
Packaging |
Tray |
Published |
2006 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PCX755 |
Speed |
400MHz |
Core Processor |
PowerPC |
Voltage - I/O |
2.5V 3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RoHS Status |
Non-RoHS Compliant |
PCX755CVZFU400LE Overview
Since the microprocessor is packed in 360-BBGA Exposed Pad, shipping overseas is convenient. High reliability is provided by the advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. Understand the operating temperature around -40°C~110°C TJ. PowerPC processors are embedded in this CPU. 2.5V 3.3V is the CPU's I/O address. Use PCX755 when searching for variants of the embedded microprocessor. A supplier offers a 360-PBGA (25x25) package.
PCX755CVZFU400LE Features
PowerPC Core
PCX755CVZFU400LE Applications
There are a lot of Microchip Technology PCX755CVZFU400LE Microprocessor applications.
- Office automation equipment and computer peripherals
- Gas monitoring systems
- Torpedo guidance
- Network application field
- DDC control
- Heater/Fan
- Dryers
- Auto-breaking system
- DCS control intelligent sensor
- ECG machine