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PEB 3164 F V1.1

PEB3164 Telecom device1 Circuits


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-PEB 3164 F V1.1
  • Package: 64-LQFP
  • Datasheet: -
  • Stock: 787
  • Description: PEB3164 Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 64-LQFP
Supplier Device Package P-TQFP-64
Operating Temperature 0°C~70°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PEB3164
Function Subscriber Line Interface CODEC Filter (SLICOFI)
Number of Circuits 1

PEB 3164 F V1.1 Overview


Saving board space is achieved with the 64-LQFP package.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.The telecom IC is composed of 1 circuits.Operating temperatures of 0°C~70°C can ensure reliable performance.The PEB3164 base part number can be used to find more related parts.

PEB 3164 F V1.1 Features


Available in the 64-LQFP package

PEB 3164 F V1.1 Applications


There are a lot of Infineon Technologies PEB 3164 F V1.1 Telecom applications.

  • Fiber In The Loop (FITL)
  • DECT (Digital European Cordless Telephone) Base Stations
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Inverse Multiplexing for ATM (IMA)
  • Digital Access Cross-connect System (DACs)
  • SONET/SDH terminal
  • Cable Telephony
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Hybrid fiber coax (HFC)
  • ISDN Primary Rate Interfaces (PRA)

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