Parameters |
Mounting Type |
Surface Mount |
Package / Case |
64-QFP |
Supplier Device Package |
P-MQFP-64-1 |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
DuSLIC |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.3V |
Base Part Number |
PEB3264 |
Function |
Dual Channel Subscriber Line Interface Circuit (DuSLIC) |
Interface |
IOM-2, PCM |
Number of Circuits |
2 |
Current - Supply |
105mA |
PEB 3264 H V1.4 Overview
Board space can be saved by using the 64-QFP package.Packing is done according to the Tray method.Telecommunications equipment is mounted using Surface Mount.There are 2 circuits in this telecom IC .When the voltage for 3.3V is provided, improved efficiency can be achieved.At 0°C~70°C, reliable performance can be achieved.In addition to telecom switching's base part number PEB3264, it can be used to find other related parts.The supply current is 105mA.With its similar functionality to electronic parts under the DuSLIC series, it can perform a number of similar tasks.
PEB 3264 H V1.4 Features
Available in the 64-QFP package
PEB 3264 H V1.4 Applications
There are a lot of Infineon Technologies PEB 3264 H V1.4 Telecom applications.
- Hybrid fiber coax (HFC)
- Integrated Access Devices
- PCM Test Equipment
- E1 Rates PCM Line Interface
- Home Gateway
- Integrated Multi-Service Access Platforms (IMAPs)
- T1/E1/J1 add/drop multiplexers (MUX)
- Intelligent PBX
- Residential Gateways
- Interfaces to DS3