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PEB 3264 H V1.4

PEB3264 Telecom device2 Circuits


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-PEB 3264 H V1.4
  • Package: 64-QFP
  • Datasheet: PDF
  • Stock: 959
  • Description: PEB3264 Telecom device2 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 64-QFP
Supplier Device Package P-MQFP-64-1
Operating Temperature 0°C~70°C
Packaging Tray
Series DuSLIC
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Base Part Number PEB3264
Function Dual Channel Subscriber Line Interface Circuit (DuSLIC)
Interface IOM-2, PCM
Number of Circuits 2
Current - Supply 105mA

PEB 3264 H V1.4 Overview


Board space can be saved by using the 64-QFP package.Packing is done according to the Tray method.Telecommunications equipment is mounted using Surface Mount.There are 2 circuits in this telecom IC .When the voltage for 3.3V is provided, improved efficiency can be achieved.At 0°C~70°C, reliable performance can be achieved.In addition to telecom switching's base part number PEB3264, it can be used to find other related parts.The supply current is 105mA.With its similar functionality to electronic parts under the DuSLIC series, it can perform a number of similar tasks.

PEB 3264 H V1.4 Features


Available in the 64-QFP package

PEB 3264 H V1.4 Applications


There are a lot of Infineon Technologies PEB 3264 H V1.4 Telecom applications.

  • Hybrid fiber coax (HFC)
  • Integrated Access Devices
  • PCM Test Equipment
  • E1 Rates PCM Line Interface
  • Home Gateway
  • Integrated Multi-Service Access Platforms (IMAPs)
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Intelligent PBX
  • Residential Gateways
  • Interfaces to DS3

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