PEB 3265 H V1.5
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 64-QFP |
| Supplier Device Package | P-MQFP-64-1 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | DuSLIC |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Base Part Number | PEB3265 |
| Function | Dual Channel Subscriber Line Interface Circuit (DuSLIC) |
| Interface | IOM-2, PCM |
| Number of Circuits | 2 |
| Current - Supply | 105mA |
PEB 3265 H V1.5 Overview
In order to save space on the board, the 64-QFP package is used.For telecommunications equipment packing, the Tray method is used.Telecommunications equipment is mounted using Surface Mount.2 circuits make up this telecom IC .The supply voltage of 3.3V can increase efficiency.Operating temperatures of 0°C~70°C can ensure reliable performance.Telecom switching's base part number of PEB3265 can be used to find more related parts.A 105mA-volt supply current is used to operate telecom equipment .This part can perform many functions similar to the electronic parts under the DuSLIC series.
PEB 3265 H V1.5 Features
Available in the 64-QFP package
PEB 3265 H V1.5 Applications
There are a lot of Infineon Technologies PEB 3265 H V1.5 Telecom applications.
- High-Density T1/E1/J1 interfaces for Multiplexers
- Wireless base stations
- Network Multiplexing and Terminating Equipment
- T1/E1/J1 Performance Monitoring
- ATM Switches
- T1 Rates PCM Line Interface
- Hybrid fiber coax (HFC)
- Home Gateway
- Dual battery supply voltage SLICs
- PDH Multiplexers
