PEB 3324 E V1.4
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 176-LBGA |
| Supplier Device Package | PG-LBGA-176 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | VINETIC® |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Power (Watts) | 400mW |
| Base Part Number | PEB3324 |
| Function | Analog Voice Access |
| Interface | ADPCM |
| Number of Circuits | 4 |
| RoHS Status | Non-RoHS Compliant |
PEB 3324 E V1.4 Overview
176-LBGA package is used to save board space.Telecommunications equipment is packed according to Tray's method.Surface Mount is used as telecommunications equipment mounting type.This telecom IC is composed of 4 circuits.The operating temperature set at -40°C~85°C can offer reliable performance.Telecom switching's base part number, PEB3324, can be used to find related parts.This part can perform many functions similar to the electronic parts under the VINETIC? series.
PEB 3324 E V1.4 Features
Available in the 176-LBGA package
PEB 3324 E V1.4 Applications
There are a lot of Infineon Technologies PEB 3324 E V1.4 Telecom applications.
- Microwave transmission systems
- Add/Drop multiplexers (ADMs)
- Fault Tolerant Systems
- PBXs channel bank
- Fiber
- High-Density T1/E1/J1 interfaces for Multiplexers
- SDH/SONET multiplexers
- E2 Rates PCM Line Interface
- High speed data transmission line cards
- ATM equipment with integrated DS1 interfaces
