Parameters |
Mounting Type |
Surface Mount |
Package / Case |
176-LQFP |
Supplier Device Package |
PG-LQFP-176 |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Series |
VINETIC® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Power (Watts) |
400mW |
Base Part Number |
PEB3324 |
Function |
Analog Voice Access |
Interface |
ADPCM |
Number of Circuits |
4 |
PEB 3324 HL V1.4 Overview
To save board space, the 176-LQFP package is used.The way of Tray is employed for telecommunications equipment packing.A Surface Mount mounting type is used.An 4-circuit makes up this telecom IC .A -40°C~85°C-temperature setting offers reliable performance.Telecom switching's base part number of PEB3324 can be a method to find more related parts.There are many similarities between it and the electronic parts of the VINETIC? series.
PEB 3324 HL V1.4 Features
Available in the 176-LQFP package
PEB 3324 HL V1.4 Applications
There are a lot of Infineon Technologies PEB 3324 HL V1.4 Telecom applications.
- Digital loop carrier (DLC)
- DECT (Digital European Cordless Telephone) Base Stations
- PDH Multiplexers
- Private branch exchange (PBX)
- E1 LAN/WAN Routers
- Codec function on telephone switch line cards
- Home Side Box
- PBX (Private Branch Exchange)
- Digital Modems
- Channel Service Units (CSUs): T1/E1/J1