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PEF 20470 H V1.3

PEF20470 Telecom device1 Circuits


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-PEF 20470 H V1.3
  • Package: 100-BQFP
  • Datasheet: PDF
  • Stock: 785
  • Description: PEF20470 Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 100-BQFP
Supplier Device Package P-MQFP-100
Operating Temperature -40°C~85°C
Packaging Tray
Series SWITI
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.13V~3.47V
Base Part Number PEF20470
Function Switching IC
Interface PCM, PLL
Number of Circuits 1
Current - Supply 200mA

PEF 20470 H V1.3 Overview


In order to save space on the board, the 100-BQFP package is used.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.A 1-circuit composes this telecom IC .3.13V~3.47V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A -40°C~85°C-temperature setting offers reliable performance.Telecom switching's base part number, PEF20470, can be used to find related parts.A current of 200mA is used as the supply current.The SWITI series is capable of providing a number of similar functions to the W series.

PEF 20470 H V1.3 Features


Available in the 100-BQFP package

PEF 20470 H V1.3 Applications


There are a lot of Infineon Technologies PEF 20470 H V1.3 Telecom applications.

  • Digital subscriber line access multiplexer (DSLAM)
  • Interfaces to E3
  • T3 channelized access concentrators
  • Interfaces to SONET STS-1 Networks
  • Digital Cross-connect Systems (DCS)
  • Cross Connects
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • E2 Rates PCM Line Interface
  • M13 MUX

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