Parameters |
Mounting Type |
Surface Mount |
Package / Case |
100-BQFP |
Supplier Device Package |
P-MQFP-100 |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Series |
SWITI |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.13V~3.47V |
Base Part Number |
PEF20470 |
Function |
Switching IC |
Interface |
PCM, PLL |
Number of Circuits |
1 |
Current - Supply |
200mA |
PEF 20470 H V1.3 Overview
In order to save space on the board, the 100-BQFP package is used.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.A 1-circuit composes this telecom IC .3.13V~3.47V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A -40°C~85°C-temperature setting offers reliable performance.Telecom switching's base part number, PEF20470, can be used to find related parts.A current of 200mA is used as the supply current.The SWITI series is capable of providing a number of similar functions to the W series.
PEF 20470 H V1.3 Features
Available in the 100-BQFP package
PEF 20470 H V1.3 Applications
There are a lot of Infineon Technologies PEF 20470 H V1.3 Telecom applications.
- Digital subscriber line access multiplexer (DSLAM)
- Interfaces to E3
- T3 channelized access concentrators
- Interfaces to SONET STS-1 Networks
- Digital Cross-connect Systems (DCS)
- Cross Connects
- High-Density T1/E1/J1 interfaces for Multiplexers
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- E2 Rates PCM Line Interface
- M13 MUX