PEF 22552 E V1.1
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 160-LBGA |
| Supplier Device Package | P/PG-LBGA-160-1 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | DualFALC™ |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 1.8V 3.3V |
| Base Part Number | PEF22552 |
| Function | Framer, Line Interface Unit (LIU) |
| Interface | E1, HDLC, J1, T1 |
| Number of Circuits | 2 |
| RoHS Status | Non-RoHS Compliant |
PEF 22552 E V1.1 Overview
A 160-LBGA package is used to reduce board space requirements.Packing is done according to the Tray method.The mounting type of this telecom circuit is Surface Mount.A 2-circuit composes this telecom IC .Providing 1.8V 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.By using telecom switching's base part number of PEF22552, it is possible to find more related parts.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the DualFALC? series.
PEF 22552 E V1.1 Features
Available in the 160-LBGA package
PEF 22552 E V1.1 Applications
There are a lot of Infineon Technologies PEF 22552 E V1.1 Telecom applications.
- Central office (CO)
- Integrated Access Devices (IADs)
- PBX interfaces
- NIU
- Hybrid fiber coax (HFC)
- Digital Access Cross-connect System (DACs)
- Short/Medium Loop
- Voice over IP/DSL
- Private branch exchange (PBX)
- PBXs channel bank
