PEF 22554 HT V3.1
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Supplier Device Package | P-TQFP-144-6 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | QuadFALC™ |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Power (Watts) | 150mW |
| Voltage - Supply | 1.8V 3.3V |
| Base Part Number | PEF22554 |
| Function | Framer, Line Interface Unit (LIU) |
| Interface | E1, J1, SCI, SPI, T1 |
| Number of Circuits | 2 |
PEF 22554 HT V3.1 Overview
The 144-LQFP package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.Surface Mount is used as telecommunications equipment mounting type.Telecom circuit is made up of 2 circuits.When the voltage for 1.8V 3.3V is provided, improved efficiency can be achieved.-40°C~85°C is the operating temperature that can be set for reliable performance.The PEF22554 base part number can be used to find more related parts.With the QuadFALC? series electronic parts, it can provide a lot of similar features.
PEF 22554 HT V3.1 Features
Available in the 144-LQFP package
PEF 22554 HT V3.1 Applications
There are a lot of Infineon Technologies PEF 22554 HT V3.1 Telecom applications.
- E1 Rates PCM Line Interface
- E1 Network Equipment
- Cable Telephony
- PCM channel bank
- Remote wireless modules
- Fault Tolerant Systems
- Multichannel DS1 Test Equipment
- Digital Cross-connect Systems (DCS)
- High-Density T1/E1/J1 interfaces for Multiplexers
- DECT (Digital European Cordless Telephone) Base
