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PEF 22624 E V2.2-G

PEF22624 Telecom device2 Circuits


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-PEF 22624 E V2.2-G
  • Package: 324-LBGA
  • Datasheet: PDF
  • Stock: 294
  • Description: PEF22624 Telecom device2 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 324-LBGA
Operating Temperature -40°C~85°C
Packaging Tray
Series SOCRATES™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 500mW
Reach Compliance Code compliant
Base Part Number PEF22624
Function Symmetrical DSL Front End (SDFE)
Interface HDLC, Serial, TDM
Number of Circuits 2

PEF 22624 E V2.2-G Overview


In order to save space on the board, the 324-LBGA package is used.Telecommunications equipment is packed according to Tray's method.In this case, Surface Mount is the mounting type.A 2 circuit is the heart of this telecom IC .Operating temperatures of -40°C~85°C can ensure reliable performance.Telecom switching's base part number of PEF22624 can be used to find more related parts.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the SOCRATES? series.

PEF 22624 E V2.2-G Features


Available in the 324-LBGA package

PEF 22624 E V2.2-G Applications


There are a lot of Infineon Technologies PEF 22624 E V2.2-G Telecom applications.

  • ATM equipment with integrated DS1 interfaces
  • E1 Network Equipment
  • Central office
  • E2 Rates PCM Line Interface
  • Cross Connects
  • ISDN terminal adapter
  • DSLAMs
  • PBX (Private Branch Exchange)
  • Fiber Optic Terminals
  • T1 Rates PCM Line Interface

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