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PEF 24471 E V1.3

PEF24471 Telecom device1 Circuits


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-PEF 24471 E V1.3
  • Package: 217-BGA
  • Datasheet: PDF
  • Stock: 582
  • Description: PEF24471 Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 217-BGA
Supplier Device Package 217-BGA (23x23)
Operating Temperature -40°C~85°C
Packaging Tray
Series SWITI
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.13V~3.47V
Base Part Number PEF24471
Function Switching IC
Interface PCM, PLL
Number of Circuits 1
Current - Supply 200mA
RoHS Status Non-RoHS Compliant

PEF 24471 E V1.3 Overview


A 217-BGA package is used to reduce board space requirements.Telecommunications equipment is packed according to Tray's method.Telecommunications equipment is mounted with type Surface Mount.Telecom circuit is made up of 1 circuits.A higher supply voltage for 3.13V~3.47V will improve efficiency.A temperature setting of -40°C~85°C ensures reliable performance.Telecom switching's base part number of PEF24471 can be a method to find more related parts.There is a supply current of 200mA for telecom equipment to operate on.There are many similarities between it and the electronic parts of the SWITI series.

PEF 24471 E V1.3 Features


Available in the 217-BGA package

PEF 24471 E V1.3 Applications


There are a lot of Infineon Technologies PEF 24471 E V1.3 Telecom applications.

  • E1 Rates PCM Line Interface
  • E2 Rates PCM Line Interface
  • Fiber Optic Terminals
  • PBXs channel bank
  • Cable Modem
  • DECT (Digital European Cordless Telephone) Base
  • Digital Modems
  • Digital access cross connects
  • Home Side Box
  • Voice over packet gateways

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