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PEF 24624 E V2.1-G

PEF24624 Telecom device4 Circuits


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-PEF 24624 E V2.1-G
  • Package: 324-LBGA
  • Datasheet: PDF
  • Stock: 459
  • Description: PEF24624 Telecom device4 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 324-LBGA
Supplier Device Package P-LBGA-324
Operating Temperature -40°C~85°C
Packaging Tray
Series SOCRATES™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PEF24624
Function Symmetrical DSL Front End (SDFE)
Interface ISDN, SHDSL
Number of Circuits 4

PEF 24624 E V2.1-G Overview


In order to save space on the board, 324-LBGA packages are used.Telecommunications equipment is packed using the Tray method.The mounting type is Surface Mount.Telecom circuit is made up of 4 circuits.A temperature setting of -40°C~85°C ensures reliable performance.By using telecom switching's base part number of PEF24624, it is possible to find more related parts.With its similar functionality to electronic parts under the SOCRATES? series, it can perform a number of similar tasks.

PEF 24624 E V2.1-G Features


Available in the 324-LBGA package

PEF 24624 E V2.1-G Applications


There are a lot of Infineon Technologies PEF 24624 E V2.1-G Telecom applications.

  • Remote wireless modules
  • LAN Routers
  • T1/E1/J1 Multiplexer and Channel Banks
  • Fiber in the loop (FITL)
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • ATM equipment with integrated DS1 interfaces
  • CSU/DSU E1/T1/J1 Interface
  • PBX interfaces
  • Dual battery supply voltage SLICs
  • Hybrid fiber coax (HFC)

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