Parameters |
Interface |
DS3 / E3, E3 / T3, HDLC / PPP |
Number of Circuits |
1 |
Mounting Type |
Surface Mount |
Package / Case |
272-BGA |
Supplier Device Package |
272-BGA (27x27) |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
3.3V |
Base Part Number |
PEF3460 |
Function |
Framer, Line Interface Unit (LIU) |
PEF 3460 E V1.2-G Overview
In order to save space on the board, 272-BGA packages are used.Telecommunications equipment is packed using the Tray method.In this case, Surface Mount is the mounting type.A 1-circuit composes this telecom IC .When 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.-40°C~85°C is the operating temperature that can be set for reliable performance.PEF3460 is the base part number, which can be used to find more related parts.
PEF 3460 E V1.2-G Features
Available in the 272-BGA package
PEF 3460 E V1.2-G Applications
There are a lot of Infineon Technologies PEF 3460 E V1.2-G Telecom applications.
- PDH Multiplexers
- Cable Modem
- ISDN NT1/TA
- Microwave transmission systems
- M13 MUX
- E1 Multiplexer
- Digital Access Cross-connect System (DACs)
- PCM channel bank
- ATM Switches
- Digital loop carrier (DLC)