Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Surface Mount | YES |
Supplier Device Package | 337-PBGA (21x21) |
Packaging | Tray |
JESD-609 Code | e1 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 337 |
ECCN Code | 3A001.A.3 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Applications | Bridge, PCI to Generic Local Bus |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Voltage - Supply | 3.3V 5V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Supply Voltage | 2.5V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | S-PBGA-B337 |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 70°C |
Temperature Grade | COMMERCIAL |
Interface | PCI |
Clock Frequency | 66MHz |
Bus Compatibility | PCI |
Height Seated (Max) | 2mm |
Length | 21mm |
Width | 21mm |
RoHS Status | ROHS3 Compliant |