Parameters | |
---|---|
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 300W |
Case Connection | DRAIN |
Turn On Delay Time | 63 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.7m Ω @ 25A, 10V |
Vgs(th) (Max) @ Id | 2V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 7665pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 75A Tc |
Factory Lead Time | 1 Week |
Gate Charge (Qg) (Max) @ Vgs | 95.6nC @ 5V |
Mounting Type | Through Hole |
Rise Time | 232ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±15V |
Fall Time (Typ) | 178 ns |
Package / Case | TO-220-3 |
Turn-Off Delay Time | 273 ns |
Surface Mount | NO |
Continuous Drain Current (ID) | 75A |
Gate to Source Voltage (Vgs) | 15V |
Number of Pins | 3 |
Max Dual Supply Voltage | 55V |
Weight | 6.000006g |
Drain-source On Resistance-Max | 0.0044Ohm |
Drain to Source Breakdown Voltage | 55V |
Transistor Element Material | SILICON |
Pulsed Drain Current-Max (IDM) | 240A |
Operating Temperature | -55°C~175°C TJ |
Avalanche Energy Rating (Eas) | 560 mJ |
Packaging | Tube |
Height | 9.4mm |
Published | 2010 |
Length | 10.3mm |
Series | TrenchMOS™ |
Width | 4.7mm |
Radiation Hardening | No |
JESD-609 Code | e3 |
RoHS Status | ROHS3 Compliant |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Additional Feature | LOGIC LEVEL COMPATIBLE |
Technology | MOSFET (Metal Oxide) |
Pin Count | 3 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 300W Tc |