Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Surface Mount | YES |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | 150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
JESD-609 Code | e4 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Max Power Dissipation | 2W |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 8 |
Number of Elements | 2 |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
Power Dissipation | 2W |
FET Type | 2 P-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 250m Ω @ 1A, 10V |
Vgs(th) (Max) @ Id | 2.8V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 250pF @ 20V |
Gate Charge (Qg) (Max) @ Vgs | 25nC @ 10V |
Drain to Source Voltage (Vdss) | 30V |
Continuous Drain Current (ID) | 2.3A |
JEDEC-95 Code | MS-012AA |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | -30V |
Drain to Source Breakdown Voltage | -30V |
FET Feature | Logic Level Gate |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |