PM8310A-FEI
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 896-BGA, FCBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Published | 2007 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Function | Framer |
| Interface | 4-Wire, Serial, TDM |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
PM8310A-FEI Overview
In order to save space on the board, the 896-BGA, FCBGA package is used.For telecommunications equipment packing, the Tray method is used.Surface Mount is used as telecommunications equipment mounting type.A 1-circuit composes this telecom IC .-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.
PM8310A-FEI Features
Available in the 896-BGA, FCBGA package
PM8310A-FEI Applications
There are a lot of Microchip Technology PM8310A-FEI Telecom applications.
- Add/Drop multiplexers (ADMs)
- M13 MUX
- Digital cross connects (DSX-1)
- Routers
- Channel Service Units (CSUs): T1/E1/J1
- BITS Timing
- Inverse Multiplexing for ATM (IMA)
- DECT (Digital European Cordless Telephone) Base Stations
- Digital Modems
- Fiber In The Loop (FITL)
