PM8324-FEI
| Parameters | |
|---|---|
| Packaging | Tray |
| Published | 2008 |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Function | Framer |
| Interface | E1, T1 |
| RoHS Status | ROHS3 Compliant |
PM8324-FEI Overview
A Tray-packing method is used to pack telecommunications equipment.
PM8324-FEI Features
PM8324-FEI Applications
There are a lot of Microchip Technology PM8324-FEI Telecom applications.
- ATM equipment with integrated DS1 interfaces
- PBXs channel bank
- DECT (Digital European Cordless Telephone) Base
- Switching Systems
- Remote wireless modules
- Frame Relay Switches and Access Devices (FRADS)
- Digital Access Cross-connect System (DACs)
- Wireless local loop (WLL)
- Digital cross connects (DSX-1)
- Switches
