Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-XFBGA, WLCSP |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2015 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Power Dissipation-Max | 556mW Ta 12.5W Tc |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 25m Ω @ 3A, 4.5V |
Vgs(th) (Max) @ Id | 900mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1400pF @ 6V |
Current - Continuous Drain (Id) @ 25°C | 6.2A Ta |
Gate Charge (Qg) (Max) @ Vgs | 29.4nC @ 4.5V |
Drain to Source Voltage (Vdss) | 12V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±8V |
Continuous Drain Current (ID) | 6.2A |
RoHS Status | ROHS3 Compliant |