Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 6-XFDFN Exposed Pad |
Surface Mount | YES |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2015 |
Series | TrenchFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | Tin (Sn) |
Max Power Dissipation | 265mW |
Pin Count | 6 |
Number of Elements | 2 |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 5.6 ns |
Power - Max | 265mW |
FET Type | 2 N-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 620m Ω @ 600mA, 4.5V |
Vgs(th) (Max) @ Id | 950mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 21.3pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs | 0.7nC @ 4.5V |
Rise Time | 9.2ns |
Fall Time (Typ) | 51 ns |
Turn-Off Delay Time | 19 ns |
Continuous Drain Current (ID) | 600mA |
Gate to Source Voltage (Vgs) | 8V |
Max Dual Supply Voltage | 20V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |