PMEG2010BELD,315
| Parameters | |
|---|---|
| JESD-30 Code | R-PDSO-N2 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 200μA @ 20V |
| Voltage - Forward (Vf) (Max) @ If | 490mV @ 1A |
| Forward Current | 1A |
| Operating Temperature - Junction | 150°C Max |
| Output Current-Max | 1A |
| Forward Voltage | 428mV |
| Max Reverse Voltage (DC) | 20V |
| Average Rectified Current | 1A |
| Reverse Recovery Time | 1.6 ns |
| Peak Reverse Current | 50μA |
| Max Repetitive Reverse Voltage (Vrrm) | 20V |
| Capacitance @ Vr, F | 40pF @ 1V 1MHz |
| Peak Non-Repetitive Surge Current | 6A |
| Max Forward Surge Current (Ifsm) | 6A |
| Natural Thermal Resistance | 25 °C/W |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | SOD-882 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Terminal Finish | Tin (Sn) |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 1.135W |
| Terminal Position | DUAL |
| Base Part Number | PMEG2010 |
| Pin Count | 2 |
| Reference Standard | AEC-Q101; IEC-60134 |
See Relate Datesheet
