Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 3-PowerUDFN |
Number of Pins | 3 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2007 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Terminal Finish | Tin (Sn) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Terminal Position | DUAL |
Base Part Number | PMEG2010 |
Pin Count | 3 |
Number of Elements | 1 |
Power Dissipation-Max | 0.96W |
Element Configuration | Common Anode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 1.9mA @ 20V |
Voltage - Forward (Vf) (Max) @ If | 375mV @ 1A |
Case Connection | CATHODE |
Max Reverse Leakage Current | 1.9mA |
Operating Temperature - Junction | 150°C Max |
Max Surge Current | 17A |
Output Current-Max | 1A |
Forward Voltage | 375mV |
Max Reverse Voltage (DC) | 20V |
Average Rectified Current | 1A |
Reverse Recovery Time | 50 ns |
Peak Reverse Current | 1.9mA |
Max Repetitive Reverse Voltage (Vrrm) | 20V |
Capacitance @ Vr, F | 175pF @ 1V 1MHz |
Peak Non-Repetitive Surge Current | 17A |
Recovery Time | 50 ns |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |