Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SC-90, SOD-323F |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2009 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | PMEG3002 |
Pin Count | 2 |
Reference Standard | AEC-Q101; IEC-60134 |
Number of Elements | 1 |
Power Dissipation-Max | 1.045W |
Element Configuration | Single |
Speed | Small Signal =< 200mA (Io), Any Speed |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 40μA @ 30V |
Voltage - Forward (Vf) (Max) @ If | 480mV @ 200mA |
Forward Current | 200mA |
Max Reverse Leakage Current | 40μA |
Operating Temperature - Junction | 150°C Max |
Max Surge Current | 2.75A |
Forward Voltage | 480mV |
Max Reverse Voltage (DC) | 30V |
Average Rectified Current | 200mA |
Reverse Recovery Time | 5 ns |
Peak Reverse Current | 40μA |
Max Repetitive Reverse Voltage (Vrrm) | 30V |
Capacitance @ Vr, F | 18pF @ 1V 1MHz |
Peak Non-Repetitive Surge Current | 2.75A |
Recovery Time | 5 ns |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |