Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 2-XDFN |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Cut Tape (CT) |
Published | 2015 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Reference Standard | IEC-60134 |
Operating Temperature (Max) | 150°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 1250μA @ 40V |
Voltage - Forward (Vf) (Max) @ If | 505mV @ 1A |
Forward Current | 1A |
Operating Temperature - Junction | 150°C Max |
Max Reverse Voltage (DC) | 40V |
Average Rectified Current | 1A |
Reverse Recovery Time | 3.1 ns |
Capacitance @ Vr, F | 75pF @ 1V 1MHz |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |