Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOD-128 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2011 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Terminal Finish | Tin (Sn) |
Max Operating Temperature | 175°C |
Min Operating Temperature | -55°C |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 2.5W |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | PMEG4030 |
Pin Count | 2 |
JESD-30 Code | R-PDSO-F2 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 200μA @ 40V |
Voltage - Forward (Vf) (Max) @ If | 490mV @ 3A |
Forward Current | 3A |
Max Reverse Leakage Current | 200μA |
Operating Temperature - Junction | 175°C Max |
Max Surge Current | 50A |
Application | EFFICIENCY |
Forward Voltage | 430mV |
Max Reverse Voltage (DC) | 40V |
Average Rectified Current | 3A |
Number of Phases | 1 |
Peak Reverse Current | 200μA |
Max Repetitive Reverse Voltage (Vrrm) | 40V |
Capacitance @ Vr, F | 350pF @ 1V 1MHz |
Peak Non-Repetitive Surge Current | 50A |
Max Forward Surge Current (Ifsm) | 50A |
Natural Thermal Resistance | 12 °C/W |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |