Parameters | |
---|---|
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | 260 |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | PMEG4050 |
Pin Count | 2 |
Reference Standard | AEC-Q101; IEC-60134 |
Operating Temperature (Max) | 150°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 300μA @ 40V |
Voltage - Forward (Vf) (Max) @ If | 490mV @ 5A |
Forward Current | 5A |
Operating Temperature - Junction | 150°C Max |
Application | EFFICIENCY |
Voltage - DC Reverse (Vr) (Max) | 40V |
Number of Phases | 1 |
Rep Pk Reverse Voltage-Max | 40V |
Capacitance @ Vr, F | 600pF @ 1V 1MHz |
Reverse Current-Max | 300μA |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | SOD-128 |
Surface Mount | YES |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2009 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
HTS Code | 8541.10.00.80 |
Terminal Position | DUAL |