PMEG6010ESBYL
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 2-XDFN |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Terminal Position | BOTTOM |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Reference Standard | IEC-60134 |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 1 |
| Configuration | SINGLE |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 30μA @ 60V |
| Voltage - Forward (Vf) (Max) @ If | 730mV @ 1A |
| Forward Current | 1A |
| Operating Temperature - Junction | 150°C Max |
| Max Reverse Voltage (DC) | 60V |
| Average Rectified Current | 1A |
| Reverse Recovery Time | 2.4 ns |
| Capacitance @ Vr, F | 20pF @ 10V 1MHz |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
