Parameters | |
---|---|
Input Capacitance (Ciss) (Max) @ Vds | 840pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 9A Ta |
Gate Charge (Qg) (Max) @ Vgs | 20.6nC @ 10V |
Rise Time | 10ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 9 ns |
Turn-Off Delay Time | 17 ns |
Continuous Drain Current (ID) | 9A |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | 30V |
Drain Current-Max (Abs) (ID) | 9A |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 34A |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 6-UDFN Exposed Pad |
Surface Mount | YES |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2014 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | Tin (Sn) |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Pin Count | 6 |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 1.7W Ta 12.5W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 9 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 14.5m Ω @ 9A, 10V |
Vgs(th) (Max) @ Id | 2V @ 250μA |