Parameters | |
---|---|
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 3 |
Reference Standard | IEC-60134 |
JESD-30 Code | R-PDSO-N3 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 317mW Ta 8.33W Tc |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 85m Ω @ 2.9A, 4.5V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 608pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 2.9A Ta |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Gate Charge (Qg) (Max) @ Vgs | 12nC @ 4.5V |
Mounting Type | Surface Mount |
Package / Case | 3-XDFN Exposed Pad |
Drain to Source Voltage (Vdss) | 20V |
Transistor Element Material | SILICON |
Drive Voltage (Max Rds On,Min Rds On) | 1.2V 4.5V |
Vgs (Max) | ±8V |
Operating Temperature | -55°C~150°C TJ |
Continuous Drain Current (ID) | 2.9A |
Drain-source On Resistance-Max | 0.085Ohm |
Packaging | Tape & Reel (TR) |
DS Breakdown Voltage-Min | 20V |
RoHS Status | ROHS3 Compliant |
Published | 2014 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Technology | MOSFET (Metal Oxide) |