Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mounting Type | Surface Mount |
Package / Case | 3-XFDFN |
Surface Mount | YES |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 3 |
Number of Elements | 1 |
Power Dissipation-Max | 360mW Ta 2.7W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 715mW |
Case Connection | DRAIN |
Turn On Delay Time | 18 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 850m Ω @ 400mA, 4.5V |
Vgs(th) (Max) @ Id | 1.3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 87pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 680mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 1.14nC @ 4.5V |
Rise Time | 30ns |
Drain to Source Voltage (Vdss) | 20V |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±8V |
Fall Time (Typ) | 72 ns |
Turn-Off Delay Time | 80 ns |
Continuous Drain Current (ID) | 680mA |
Gate to Source Voltage (Vgs) | 8V |
Max Dual Supply Voltage | -20V |
Drain Current-Max (Abs) (ID) | 0.68A |
Drain-source On Resistance-Max | 0.85Ohm |
Drain to Source Breakdown Voltage | -20V |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |