Parameters | |
---|---|
Package / Case | TFBGA |
Surface Mount | YES |
Number of Pins | 64 |
JESD-609 Code | e1 |
Moisture Sensitivity Level (MSL) | 1 |
Number of Terminations | 64 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -30°C |
HTS Code | 8542.39.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 1.8V |
Terminal Pitch | 0.65mm |
Frequency | 13.56MHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Temperature Grade | OTHER |
Interface | SPI, UART |
Telecom IC Type | TELECOM CIRCUIT |
Height Seated (Max) | 1.15mm |
Length | 5.5mm |
Width | 5.5mm |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |